Finally Intel completed the new design of its first mobile WiMax chip. But before you put your hopes up to high, it won't be appearing on notebooks until 2008 (or at least they're hoping to). The whole idea is to integrate that chip with Wi-Fi to
create a chipset it calls WiMax Connection 2300.
The whole idea is said to be a one great leap for Intel in reaching its goal of creating a total mobile WiMax platform. With this design the area where people can access a wireless internet connection will be bigger. And it will even provide a faster speed than most networks provide. The concept and idea that is taking place at the present was delivered by Intel Vice President Sean Maloney at the 3G World Congress and Mobility Marketplace in Hong Kong.
Many enthusiasts look up to WiMax to fullfill the great promise of networking technology that will deliver wireless broadband access over a range much greater than that of Wi-Fi. But reality wise they still won't give up their tried and tested cable and DSL broadband connections around the U.S.
Basically, looking at the whole package of the design of WiMax, it is indeed a promising and worth the wait idea that is slowly coming to life byt the sec. In addition, WiMax connectivity, WiMax Connection 2300 will integrate the latest support for MIMO -- or multiple input, multiple output -- Wi-Fi networking. High battery lives, thinner notebooks (can it possibly get thinner?), and the WiMax and Wi-Fi functionality will be controlled from the same central software application. What else can we ask for? Though the the design is now complete, it still has a long way to go befor eit makes its way to the palm of your hands. The most you can get for now is their offer test samples of WiMax Connection 2300 in 2007.
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